Encapsulation Technologies for Electronic Applications
  • Release Date : 23 October 2018
  • Publisher : William Andrew
  • Categories : Technology & Engineering
  • Pages : 508 pages
  • ISBN 13 : 9780128119792
  • ISBN 10 : 0128119799
Score: 4
From 245 Ratings
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Synopsis : Encapsulation Technologies for Electronic Applications written by Haleh Ardebili, published by William Andrew which was released on 23 October 2018. Download Encapsulation Technologies for Electronic Applications Books now! Available in PDF, EPUB, Mobi Format. Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them